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[Prototype] Low Dielectric Adhesive

A coating with excellent transparency! It can be used in transparent antennas such as 5G and 6G, as well as in high-frequency materials.

This product is a prototype of a "low dielectric adhesive" created by the Functional Coating Division of Arakawa Chemical Industries, Ltd. The solvent is butyl acetate, and the non-volatile content of the adhesive is 40%. It forms a coating film that is low dielectric and has excellent transparency. Please feel free to contact us when you need it. 【Specifications (partial)】 ■Main agent / Hardener (wt%): 97 / 3 ■Solvent / Non-volatile content of adhesive: Butyl acetate / 40% ■Drying conditions / Dry film thickness: 120℃×5min / 75μm ■Dielectric constant Dk / Dielectric loss tangent Df (SPDR 10GHz): 2.36 / 0.0036 ★In addition to low dielectric adhesives, we also offer non-flowable latent heat storage materials, functional water-based barrier coatings, and thermosetting functional coatings. *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables
  • Low Dielectric Adhesive

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